PROBLEM TO BE SOLVED: To provide a pin joint method for a substrate which can make the solder amount uniform simply in a small number of processes.;SOLUTION: In the manufacturing method of a PGA system package substrate 4, a pin 6 is formed by using a solder ball 1 in order to control the solder amount uniformly. A pin joint method for joining the head 6a of a pin 6 to the pad portion 4a of the substrate 4 with solder comprises: a counter setting process for positioning the pad portion of the substrate and the pin head against each other with a solder ball in-between after setting the solder ball 1 on the pad portion of the substrate or the pin head; a junction process for heating and fusing the solder between the pad portion and the pin head.;COPYRIGHT: (C)2012,JPO&INPIT
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