On cartridge head of reflected cup circles of the core metal which formed the reflected cup section in

摘要

PROBLEM TO BE SOLVED: To provide a light emitting device mounting board which is superior in heat dissipation, hardly generates cracking or the like in an insulating layer so that excellent electric insulation can be realized, and hardly enter air bubbles during sealing of resin, as well as its manufacturing method; and to provide a light emitting device module wherein a light emitting device is mounted to the board, a lighting device, a display device, and a traffic signal.;SOLUTION: The light emitting device mounting board is formed by applying a varnish containing a heat resistance resin or its precursor onto a core metal with a reflection cup like a thin film, curing it to form an electric insulating resin layer, and furthermore by providing a conductive layer the electric insulating resin layer. In the light emitting device mounting board, the core metal with the reflection cup is prepared, a varnish containing a heat resistance resin or its precursor is applied like a thin film onto the surface of the core metal, the varnish is cured to form an electric insulating resin layer thereon, a conductive paste is printed on the electric insulating resin layer along an electrode pattern to be formed, and the conductive paste is baked onto the electric insulating resin layer.;COPYRIGHT: (C)2007,JPO&INPIT