METHOD OF MANUFACTURING SUBSTRATE WITH GOLD-PLATING METAL FINE PATTERN, SUBSTRATE WITH GOLD-PLATING METAL FINE PATTERN, PRINTED WIRING BOARD, INTERPOSER, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate with a gold-plating metal fine pattern having an excellent electroless plating characteristic during a SAP process, capable of forming a fine circuit and of improving inter-wiring insulation reliability and connection reliability of the fine circuit by suppressing abnormal precipitation during a gold-plating process, and to provide, by the manufacturing method, the substrate with the gold-plating metal fine pattern, especially a printed wiring board and a semiconductor device using the printed wiring board.SOLUTION: There are provided a step for preparing a substrate having a support surface of resin, a step for providing a substrate with a metal fine pattern by forming a primer resin layer whose surface roughness is 0.5 μm or less on the support surface, and forming the metal fine pattern over it by a SAP method, and a step for performing a gold-plating process on at least a part of the surface of the metal fine pattern. In an arbitrary step before the gold-plating process, a palladium eliminating process is applied on the substrate with the metal fine pattern.