METHOD FOR MANUFACTURING BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, PRINTED WIRING BOARD, INTERPOSER, AND SEMICONDUCTOR DEVICE

摘要

Disclosed is a method for manufacturing a base material having a gold-plated metal fine pattern, which includes: a step wherein the base material having a supporting surface composed of a resin is prepared; a step wherein the base material having the metal fine pattern is obtained by forming a primer resin layer having a surface roughness of 0.5 μm or less on the supporting surface, and forming the metal fine pattern on the primer resin layer using an SAP method; and a step wherein the surface of at least a part of the metal fine pattern is plated with gold. In a discretionary step before performing the gold plating, palladium is removed from the base material having the metal fine pattern.