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Formation of a silicon-germanium-on-insulator structure by oxidation of the buried porous silicon layer

机译:通过掩埋多孔硅层的氧化形成绝缘体上硅锗结构

摘要

Topic Being simple forms the SiGe on insulator layer of the porous silicon which is formed under Ge content layer (or the territory) by oxidizing offer direct method.SolutionsThis method the step which converts the territory where step and this positive hole which offer the structure which has the Ge content layer on the Si content baseplate, and this Si content baseplate where the territory where the positive hole is included mainly was formed in are included mainly to the porous territory and, in order to offer the SiGe on insulator material which is eased substantially, includes with the step which the structure which includes this porous territory annealing is done. Selective figure Figure 3
机译:<主题>通过氧化在Ge含量层(或区域)下形成的多孔硅的绝缘层上简单形成SiGe提供了直接的方法。解决方案该方法是将步骤中的区域转换为该步骤并提供该空穴的正孔。为了在绝缘体材料上提供SiGe,在Si含量基板上具有Ge含量层的结构,以及主要形成有包含空穴的区域的该Si含量基板主要包括在多孔区域中。基本简化,包括完成包括该多孔区域退火的结构的步骤。

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