After the photoresist burbling and the metal etching you install in high chamber temperature process and the chamber design null

摘要

Vacuum chamber for removing the photoresist layer formed on a semiconductor substrate and / or passivated. It includes an internal chamber body, the internal chamber body, a plurality of gas passages forming a cavity for surrounding the substrate, leading to the cavity and extending through the internal chamber body, the chamber 1 for heating the internal chamber body and a heater of one or many. The outer chamber body on surrounding a state where there is a gap between the sides of the interior chamber, the internal chamber body, slidably mounted. The apparatus also is mounted within the chamber body on to cover in the presence of a gap between the exhaust unit which is operative to pump suction and discharge the gas from the cavity, the upper surface of the internal chamber body, in fluid communication with the gas passage and a plasma source coupled to the opening to be able to operate to the plasma state by exciting having an opening, a chamber top part, a gas, is in fluid communication with the cavity.