首页> 外国专利> Component mounting apparatus, calibration method of the component mounting apparatus, calibration method of the component mounting apparatus in the component mounting line and component mounting line

Component mounting apparatus, calibration method of the component mounting apparatus, calibration method of the component mounting apparatus in the component mounting line and component mounting line

机译:部件安装设备,部件安装设备的校准方法,部件安装线和部件安装线中的部件安装设备的校准方法

摘要

PROBLEM TO BE SOLVED: To provide a component mounting apparatus for continuously verifying calibration accuracy without removing a component for calibration from a calibration substrate after the calibration of control data, and to provide a calibration method of the component mounting apparatus, a component mounting line, and the calibration method of the component mounting apparatus in the component mounting line.;SOLUTION: After positioning S11 the calibration substrate to a predetermined position, a calibration component picked up by a mounting head is mounted to a target mounting position on the calibration substrate based on control data, and the control data are calibrated S15 by detecting S12 displacement between the actual mounting position and the target mounting position of the calibration component mounted to the calibration substrate. Next, a verification component picked up by the mounting head is mounted to a target mounting position different from the target mounting position of the calibration component based on the calibrated control data, and calibration accuracy is verified S16 by detecting displacement between the actual mounting position and the target mounting position of the verification component mounted to the calibration substrate.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种用于在不对控制数据进行校准之后从校准基板上移出用于校准的部件的情况下,连续地验证校准精度的部件安装装置,并且提供一种部件安装装置的校准方法,部件安装线,解决方案:在步骤S11中将校准基板定位到预定位置后,将由安装头拾取的校准组件安装到基于校准基板的目标安装位置上。根据控制数据,通过检测S12安装到校准基板上的校准部件的实际安装位​​置和目标安装位置之间的位移来校准控制数据。接下来,基于校准后的控制数据,将由安装头拾取的验证部件安装到与校准部件的目标安装位置不同的目标安装位置,并且通过检测实际安装位​​置与安装位置之间的位移来验证校准精度(S16)。验证组件安装到校准基板上的目标安装位置。;版权:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP4835477B2

    专利类型

  • 公开/公告日2011-12-14

    原文格式PDF

  • 申请/专利权人 パナソニック株式会社;

    申请/专利号JP20070061493

  • 发明设计人 奥田 修;

    申请日2007-03-12

  • 分类号H05K13/04;

  • 国家 JP

  • 入库时间 2022-08-21 17:36:49

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号