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Method of forming self-assembled electrical contact structure, self-assembled electrical contact structure, and electrical contact structure
Method of forming self-assembled electrical contact structure, self-assembled electrical contact structure, and electrical contact structure
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机译:自组装电触点结构的形成方法,自组装电触点结构和电触点结构
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摘要
A method of forming a self-assembled interconnect structure is described. In the method, a contact pad (104) surface and particles (304) in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.
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