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High surface impedance structure, antenna device, and RFID tag

机译:高表面阻抗结构,天线装置和RFID标签

摘要

P To provide a high surface impedance structure which contributes to the thickness reduction of an antenna unit and an RFID tag. PSOLUTION: A capacity upper electrode 21 is formed ON the top surface side of a dielectric layer 10. A ground electrode 31 in a rectangular frame shape, a center electrode 32 disposed in the center of the reverse surface and a capacity lower electrode 33 connected to the center electrode and disposed opposite the capacity upper electrode 21, an inductance portion 34 connecting the center electrode 32 and ground electrode 31 to each other and are formed ON the reverse surface side of the dielectric layer 10. The inductance part 34 is in a meander shape and increased in inductance. PCOPYRIGHT: (C)2008 and JPO& INPIT
机译:

提供有助于减小天线单元和RFID标签的厚度的高表面阻抗结构。

解决方案:电容上电极21形成在介电层10的顶表面侧。矩形框架形状的接地电极31,布置在背面中央的中心电极32和电容下电极在电介质层10的背面侧,形成有与中心电极连接并与电容上电极21相对配置的33,和将中心电极32与接地电极31彼此连接的电感部34。呈曲折状并增加电感。

版权:(C)2008和JPO&INPIT

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