In the device for methodological null baseplate processing which supports the baseplate in the device

摘要

The present invention provides a method and exemplary apparatus to ensure that it reaches the substrate edge portion of the purge gas and the substrate treatment, the substrate edge, and helps to prevent unwanted deposition of the upper for, I include the edge of the JMF-type wafer. In one embodiment, there is provided including (13), an apparatus for processing a substrate and substrate support chamber, the substrate support (13) is disposed in the chamber. Has (30) lip, the protruding top surface of the substrate support portion (36) at least partially, the edge ring defines a gap (29) between the upper surface of the lip lip (30). In this way, the edge ring is designed to form a gap for guiding the proper purge gas to the edge portion of the substrate including a JMF type substrate.