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High-Voltage MOSFET with High Breakdown Voltage and Low On-Resistance and Method of Manufacturing the Same

机译:高击穿电压和低导通电阻的高压MOSFET及其制造方法

摘要

A high-voltage transistor is formed in a deep well of a first conductivity type that has been formed in a semiconductor substrate or epitaxial layer of a second conductivity type. A body region of the second conductivity type is formed in the deep well, into which a source region of the first conductivity type is formed. A drain region of the first conductivity type is formed in the deep well and separated from the body region by a drift region in the deep well. A gate dielectric layer is formed over the body region, and a first polysilicon layer formed over the gate dielectric layer embodies the gate of the transistor. The field plate dielectric layer is formed over the drift region after the gate has been formed. Finally, the field plate dielectric is covered by a second polysilicon layer having a field plate positioned over the field plate dielectric layer in the drift region.
机译:在已经形成在第二导电类型的半导体衬底或外延层中的第一导电类型的深阱中形成高压晶体管。在深阱中形成第二导电类型的体区,在其中形成第一导电类型的源极区。第一导电类型的漏极区形成在深阱中,并通过深阱中的漂移区与体区分开。在主体区域上方形成栅极介电层,并且在栅极介电层上方形成的第一多晶硅层体现晶体管的栅极。在形成栅极之后,在漂移区上方形成场板电介质层。最后,场板电介质被第二多晶硅层覆盖,第二多晶硅层具有在漂移区中位于场板电介质层上方的场板。

著录项

  • 公开/公告号US2012228704A1

    专利类型

  • 公开/公告日2012-09-13

    原文格式PDF

  • 申请/专利权人 DONG-HYUK JU;

    申请/专利号US201113041512

  • 发明设计人 DONG-HYUK JU;

    申请日2011-03-07

  • 分类号H01L29/78;H01L21/336;

  • 国家 US

  • 入库时间 2022-08-21 17:35:24

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