首页> 外国专利> THERMALLY LABILE PRECURSOR COMPOUNDS FOR IMPROVING THE INTERPARTICULATE CONTACT SITES AND FOR FILLING THE INTERSTICES IN SEMICONDUCTIVE METAL OXIDE PARTICLE LAYERS

THERMALLY LABILE PRECURSOR COMPOUNDS FOR IMPROVING THE INTERPARTICULATE CONTACT SITES AND FOR FILLING THE INTERSTICES IN SEMICONDUCTIVE METAL OXIDE PARTICLE LAYERS

机译:用于改善微粒间接触点并填充半导电金属氧化物颗粒层中空隙的热标签前体化合物

摘要

The present invention relates to a process for producing a layer comprising at least one semiconductive metal oxide on a substrate, comprising at least the steps of:;(A) applying a porous layer of at least one semiconductive metal oxide to a substrate,;(B) treating the porous layer from step (A) with a solution comprising at least one precursor compound of the semiconductive metal oxide, such that the pores of the porous layer are at least partly filled with this solution and;(C) thermally treating the layer obtained in step (B) in order to convert the at least one precursor compound of the semiconductive metal oxide to the semiconductive metal oxide,;wherein the at least one precursor compound of the at least one semiconductive metal oxide in step (B) is selected from the group consisting of carboxylates of mono-, di- or polycarboxylic acids having at least three carbon atoms or derivatives of mono-, di- or polycarboxylic acids, alkoxides, hydroxides, semicarbazides, carbamates, hydroxamates, isocyanates, amidines, amidrazones, urea derivatives, hydroxylamines, oximes, oximates, urethanes, ammonia, amines, phosphines, ammonium compounds, nitrates, nitrites or azides of the corresponding metal, and mixtures thereof.
机译:本发明涉及一种在基板上生产包含至少一种半导体金属氧化物的层的方法,该方法至少包括以下步骤:(A)在基板上施加至少一种半导体金属氧化物的多孔层; B)用包含至少一种半导体金属氧化物的前体化合物的溶液处理步骤(A)中的多孔层,以使多孔层的孔至少部分地被该溶液填充;并且(C)热处理为了将所述半导体金属氧化物的至少一种前体化合物转化为所述半导体金属氧化物而在步骤(B)中获得的层;其中,在步骤(B)中所述至少一种半导体金属氧化物的至少一种前体化合物为选自具有至少三个碳原子的一元,二元或多元羧酸的羧酸盐或一元,二元或多元羧酸的衍生物,醇盐,氢氧化物,氨基脲,氨基甲酸酯,氢am酸酯,异氰酸酯,am,酰胺,、尿素衍生物,羟胺,肟,肟酸,氨基甲酸酯,氨,胺,膦,铵化合物,相应的金属的硝酸盐,亚硝酸盐或叠氮化物及其混合物。

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