The present invention relates to semiconductor inspection and provides a technology capable of efficiently detecting a systematic defect. In the present system, with regard to the process (S7, S8) of matching hot spot (HS) points that can be simulated in advance and defect points obtained as a result of a visual inspection each other and the unmatched defect points, a process (S6, S9) of classifying the defect points into groups based on similarity of pattern layout at the defect points to determine the defects belonging to a pattern layout where defects frequently occur, thereby reliably detecting the systematic defect. Also, with a process (S11) of acquiring an uneven distribution in a defect occurrence distribution on a wafer, the systematic defect occurring due to topography of the wafer can also be detected.
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机译：本发明涉及半导体检查，并提供一种能够有效地检测系统缺陷的技术。在本系统中，关于可以预先模拟的匹配热点（HS）点的处理（S 7， S 8 ），并获得缺陷点作为目视检查和不匹配的缺陷点的结果，根据图案布局的相似性将缺陷点分为几组的过程（S 6， S 9 ）在缺陷点处确定属于频繁发生缺陷的图案布局的缺陷，从而可靠地检测系统缺陷。另外，利用在晶片上的缺陷发生分布中获取不均匀分布的过程（S 11 ），还可以检测由于晶片的形貌而发生的系统缺陷。
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