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Method and system for inter-chip communication via integrated circuit package waveguides
Method and system for inter-chip communication via integrated circuit package waveguides
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机译:通过集成电路封装波导进行芯片间通信的方法和系统
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摘要
Methods and systems for inter-chip communication via integrated circuit package waveguides are disclosed and may include communicating one or more signals between or among a plurality of integrated circuits via one or more waveguides integrated in a multi-layer package. The integrated circuits may be bonded to the multi-layer package. The waveguides may be configured via switches in the integrated circuits or by MEMS switches integrated in the multi-layer package. The signals may include a microwave signal and a low frequency control signal that may configure the microwave signal. The low frequency control signal may include a digital signal. The waveguides may comprise metal and/or semiconductor layers deposited on and/or embedded within the multi-layer package.
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