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LED package having improved light coupling efficiency for an optical system and method of manufacture thereof

机译:用于光学系统的具有提高的光耦合效率的LED封装及其制造方法

摘要

One aspect of an LED package, which is covered by this disclosure, includes at least two LED emitters located on a substrate wherein each of the at least two LED emitters forms an emitting area. The emitting area is substantially equal to a reflective area of the LED package, and the LED package has an optical axis that is substantially non-parallel to an optical axis of each of the at least two LED emitters.
机译:被本公开覆盖的LED封装的一个方面包括位于基板上的至少两个LED发射器,其中至少两个LED发射器中的每个形成发射区域。发射面积基本上等于LED封装的反射面积,并且LED封装具有基本上不平行于至少两个LED发射器中的每一个的光轴的光轴。

著录项

  • 公开/公告号US8272744B2

    专利类型

  • 公开/公告日2012-09-25

    原文格式PDF

  • 申请/专利权人 DANA F. SEGLER;STEVEN M. PENN;

    申请/专利号US20080200594

  • 发明设计人 STEVEN M. PENN;DANA F. SEGLER;

    申请日2008-08-28

  • 分类号G03B21/00;

  • 国家 US

  • 入库时间 2022-08-21 17:30:27

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