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Method of forming an inverted T shaped channel structure for an inverted T channel field effect transistor device

机译:用于倒T沟道场效应晶体管器件的形成倒T形沟道结构的方法

摘要

A method of forming an inverted T shaped channel structure having a vertical channel portion and a horizontal channel portion for an Inverted T channel Field Effect Transistor ITFET device comprises providing a semiconductor substrate, providing a first layer of a first semiconductor material over the semiconductor substrate, and providing a second layer of a second semiconductor material over the first layer. The first and the second semiconductor materials are selected such that the first semiconductor material has a rate of removal which is less than a rate of removal of the second semiconductor material. The method further comprises removing a portion of the first layer and a portion of the second layer selectively according to the different rates of removal so as to provide a lateral layer and the vertical channel portion of the inverted T shaped channel structure and removing a portion of the lateral layer so as to provide the horizontal channel portion of the inverted T shaped channel structure.
机译:一种形成具有用于反向T沟道场效应晶体管ITFET器件的垂直沟道部分和水平沟道部分的反向T形沟道结构的方法,该方法包括提供半导体衬底,在半导体衬底上方提供第一半导体材料的第一层,在第一层上方提供第二半导体材料的第二层。选择第一半导体材料和第二半导体材料,使得第一半导体材料具有的去除速率小于第二半导体材料的去除速率。该方法还包括根据不同的去除速率选择性地去除第一层的一部分和第二层的一部分,以提供倒T形通道结构的侧向层和垂直通道部分,并去除一部分T形通道结构。横向层,以提供倒T形槽结构的水平槽部分。

著录项

  • 公开/公告号US8158484B2

    专利类型

  • 公开/公告日2012-04-17

    原文格式PDF

  • 申请/专利权人 MARIUS ORLOWSKI;ANDREAS WILD;

    申请/专利号US20100679385

  • 发明设计人 ANDREAS WILD;MARIUS ORLOWSKI;

    申请日2007-10-03

  • 分类号H01L21/331;H01L21/8222;

  • 国家 US

  • 入库时间 2022-08-21 17:28:51

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