A method and system for identifying voids in solder balls in a ball-grid array (BGA) using an image of the BGA include localizing an image of a solder ball on the BGA image, the solder ball image having a radius and having multiple points each having an image intensity, and producing a void-free model image of the solder ball based on the radius of the solder ball image, the void-free model image having multiple points each having an image intensity. The method and system also include computing a difference between the image intensities of the points of the solder ball image and the image intensities of the points of the void-free model image to produce a residual image, and identifying a void using the residual image.
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