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Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method

机译:芯片拾取装置,芯片拾取方法,芯片释放装置和芯片释放方法

摘要

In the pickup apparatus wherein a chip adhered on a sheet is sucked and held by a picking nozzle and then picked up by the nozzle, a sheet push-up member configured by forming flexible elastic material such as rubber in a spherical shape is attached on the abutment supporting surface of the upper surface of a tool, then the push-up surface of the sheet push-up member is followed in a flat surface state along the lower surface of the sheet and abutted thereto in the moving down state of the picking nozzle, and then the push-up surface pushes up the lower surface of the sheet while being deformed in a upwardly protruded curved surface shape in the moving up operation where the picking nozzle moves up together with the chip. Thus, the chip can be released from the sheet from the outer peripheral side of the chip.
机译:在拾取装置中,粘附在片材上的芯片被拾取喷嘴抽吸并保持,然后由喷嘴拾取,在该拾取装置中,将通过形成诸如球形的橡胶之类的柔性弹性材料而构成的片材上推构件安装在该拾取装置上。工具的上表面的抵接支撑表面,然后沿平坦的表面状态沿着纸张的下表面跟随纸张上推构件的上推表面,并在拾取喷嘴的向下移动状态下抵靠在其上然后,在拾取喷嘴与芯片一起向上移动的向上移动操作中,上推表面在向上变形的曲面形状变形的同时向上推动薄片的下表面。因此,可以从薄片的外周侧将薄片上的薄片剥离。

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