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Semiconductor device having pads and which minimizes defects due to bonding and probing processes
Semiconductor device having pads and which minimizes defects due to bonding and probing processes
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机译:具有焊盘的半导体器件,其最小化由于键合和探测过程而导致的缺陷
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摘要
A semiconductor device includes: a semiconductor substrate; a first interlayer insulating film formed over the semiconductor substrate; a pad formed above the first interlayer insulating film; and a plurality of first interconnects spaced apart from each other in a portion of the first interlayer insulating film located below the pad. Below the pad, the first interconnects are formed in quadrangular plan shapes.
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