Heat-seal resin and package formed therefrom

摘要

Provided is a heat-seal resin. The resin includes 5 wt % to 95 wt % of a first copolymer and 95 wt % to 5 wt % of a second copolymer based on the total weight of the resin. The first copolymer and the second copolymer together are 90 wt % or more of the total weight of the resin. The first copolymer includes a first monomer of an alphaolefin of 2 to 4 carbon atoms and a second monomer selected from a second monomer of an alphaolefin of 2 to 8 carbon atoms. The first monomer and the second monomer of the first copolymer are different. The first copolymer has an MFR of from 5 to 1000 g/10 minutes and a T_fm of 66° C. to 80° C. The second copolymer includes a first monomer of an alphaolefin of 2 to 4 carbon atoms and a second monomer selected from a second monomer of an alphaolefin of 2 to 8 carbon atoms. The first monomer and the second monomer of the second copolymer are different. The second copolymer has an MFR of from 0.5 to 5 g/10 minutes and a T_fm of 45° C. to 66° C., wherein the first copolymer has an MFR of at least 2 g/10 minutes greater and a T_fm of at least 10° C. greater than the second copolymer. There is also a package formed partly or entirely of the resin.