Machine vision system for three-dimensional metrology and inspection in the semiconductor industry

摘要

The system 10 of the preferred embodiment includes a structural subsystem 20 to provide both a stable platform and vibration isolation, a camera subsystem 30 to capture the image of a moving object when the object moves into a viewing area, a lighting subsystem 50 to illuminate a moving object, and a controller to selectively activate the lighting subsystem 50 to allow observation of the reflectance of complex objects under different conditions. The system 10 has been specifically designed for illuminating and capturing the image of a moving object, such as the connecting terminals (e.g., leads, ball grids, and pads) of packaged electronic components in a manufacturing facility. The system 10 may, however, be used to illuminate and capture the image of any suitable moving or non-moving object.