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Procedure chemical vapor deposition at atmospheric pressure to produce a thin n-semiconductor layer metal sulfide
Procedure chemical vapor deposition at atmospheric pressure to produce a thin n-semiconductor layer metal sulfide
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机译:在大气压下进行化学气相沉积以生产薄的n半导体层金属硫化物
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摘要
Chemical deposition process in the gas phase at atmospheric pressure (APCVD) to produce a thin layer of n-semiconducting metal sulfide on a heated substrate with a precursor containing the metal and hydrogen sulfide (H2S) as reactive gaseous precursor and stream of inert carrier gas, characterized in that, for the manufacture of a thin layer compact indium sulphide (In2S3) to a liquid or gaseous phase a precursor containing indium (prin (g / fl)) it is having himself transferred a high pressure steam or forms a volatile adduct with a solvent, said precursor is mixed in a mixing region (MP) with the stream of inert carrier gas (IG) and hydrogen sulfide (PRH2S (g)), that it is fed in such an amount resulting absolute concentration of hydrogen sulfide (H2S) or below 1% by volume, and said mixture is conducted to the substrate (SU) heated to a temperature (T) with 100º C =; T = 275 ° C, whichever is the concentration of In precursor containing indium (prin (g / fl)) so that the thin layer of indium sulfide (In2S3) to make it compact.
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机译:在大气压下在气相中进行化学沉积工艺(APCVD),以在加热的基材上形成薄薄的n型半导体金属硫化物,其中含有金属和硫化氢(H2S)的前体作为反应性气态前体和惰性载气流,其特征在于,为了将液态的或气相的薄层致密化铟(In2S3)制成含有铟(prin(g / fl))的前体,他本人正在转移高压蒸汽或形成挥发性加合物使用溶剂,将所述前体在惰性气体(IG)和硫化氢(PRH2S(g))流的混合区域(MP)中混合,进料量应使硫化氢的绝对浓度( H 2 S或低于1体积%,并且将所述混合物引导至加热到温度为100℃的基材(SU); T <= 275°C,无论是含铟的In前驱物浓度(prin(g / fl)),还是使硫化铟薄层(In2S3)使其致密。
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