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APPARATUS FOR PRECIPITATION/SEPARATION OF EXCESS COPPER IN LEAD-FREE SOLDER
APPARATUS FOR PRECIPITATION/SEPARATION OF EXCESS COPPER IN LEAD-FREE SOLDER
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机译:无铅焊料中过量铜的沉淀/分离装置
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摘要
An apparatus for depositing and separating excess copper dissolved in molten lead-free solder containing tin as the main element is provided. An apparatus 1 deposits excess copper in the molten lead-free solder as an intermetallic compound and separates it from the molten solder. The apparatus includes a deposition bath 2 for causing an intermetallic compound in the molten solder, a metal added from the outside and copper in the molten solder to be deposited, a granulation bath 4 including plates 31 32 and 33 for allowing the molten solder to pass through the plates to merge the intermetallic compounds into particles having a larger diameter, and a separation bath 5 for causing the enlarged intermetallic compounds to precipitate and separate in the molten solder.
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