The invention relates to the field of designs and manufacturing techniques for light-emitting diodes (LEDs) and LED lamps. In order to increase the efficiency of a high-power LED, it is proposed to effect the output of quanta from a chip via special light output openings or channels. It is proposed to manufacture an LED in the form-factor of an electric light bulb. In order to increase the solid angle in which a multi-chip LED emits, it is proposed to arrange the chips in different planes, as well as to arrange the chips in the interior volume on a chip carrier which is not in direct contact with the heat removal device (radiator) of the LED. It is proposed that the transfer of heat from the LED chips to the LED radiator be carried out by means of a liquid, optically transparent, dielectric heat transfer medium. In order to render the light emission from the LEDs and LED lamps more easy on the eye, it is proposed to manufacture translucent bearing covers for LED lamps, on which the chips/LEDs are mounted on heat-dissipating substrates.
展开▼
