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Charged particle beam system having multiple user-selectable operating modes

机译:具有多种用户可选操作模式的带电粒子束系统

摘要

A method for performing milling and imaging in a focused ion beam (FIB) system (10) employing an inductively-coupled plasma ion source (100), wherein two sets of FIB system operating parameters are utilized: a first set representing optimized parameters for operating the FIB system in a milling mode, and a second set representing optimized parameters for operating in an imaging mode. These operating parameters may comprise the gas pressure in the ICP source, the RF power to the ICP source, the ion extraction voltage, and in some embodiments, various parameters within the FIB system ion column, including lens voltages and the beam-defining aperture (305) diameter. An optimized milling process provides a maximum milling rate for bulk (low spatial resolution) rapid material removal from the surface of a substrate. An optimized imaging process provides minimized material removal and higher spatial resolutions for improved imaging of the substrate area being milled.
机译:一种在采用感应耦合等离子体离子源(100)的聚焦离子束(FIB)系统(10)中执行铣削和成像的方法,其中利用了两组FIB系统操作参数:第一组代表用于操作的优化参数FIB系统处于铣削模式,第二组代表用于在成像模式下运行的优化参数。这些操作参数可能包括ICP源中的气压,ICP源的RF功率,离子提取电压,以及在某些实施例中,FIB系统离子柱内的各种参数,包括透镜电压和射束定义孔径( 305)的直径。优化的铣削工艺可提供最大的铣削速率,以实现从基材表面快速去除大量材料(低空间分辨率)。优化的成像过程可最大程度地减少材料去除,并提供更高的空间分辨率,以改善正在铣削的基材区域的成像效果。

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