PURPOSE: A method of manufacturing lens for an LED package is provided to obtain a plurality of LED packages at the same time by manufacturing lens and cutting it into a unit.;CONSTITUTION: In a method of manufacturing lens for an LED package, a wafer(10) for the LED package having a plurality of LED element areas is provided. The wafer for the LED package comprises a semiconductor wafer(12) and a bonding substrate(11). A mold(16) has a concave part(16a) corresponding to the shape of a lens to be formed in each LED element area. A release film(14) having unevenness pattern is arranged in the concave part of the mold. An unevenness pattern(14a) is formed in the surface of the molded lens.;COPYRIGHT KIPO 2012
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