PURPOSE: A four-terminal type printed circuit substrate inspection method is provided to precisely recognize a point of a pad and alignment of a printed circuit substrate by a CCD(Charge Coupled Device) camera, thereby significantly reducing faults in inspection. CONSTITUTION: Data is inputted to inspection equipment detecting fault products(S10). A jig matched to each printed circuit substrate is set based on the inputted data(S20). An alignment of the printed circuit substrate is performed through a CCD(Charge Coupled Device) camera(S30). The fault products are detected by comparing with the data saved in advance in the inspection equipment(S40). The printed circuit substrate determined as a normal product is transferred to a table(S60).
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