WAFER ALIGNMENT METHOD CAPABLE OF PRECISELY ALIGNING A WAFER AND A PROCESS MONITORING METHOD

摘要

PURPOSE: A wafer alignment method and a process monitoring method are provided to precisely align a wafer by selecting an optimum alignment signal using the alignment location offsets of an alignment mark.;CONSTITUTION: Light is irradiated on a plurality of alignment marks which are formed on a wafer(S110). Alignment location offsets of the alignment mark according to different two wavelengths or two diffraction degrees are obtained(S120). The alignment marks having similar or same dispersion among the alignment location offsets is selected(S130). The wafer is aligned based on detect information about the selected alignment marks which are selected(S140).;COPYRIGHT KIPO 2012