首页> 外国专利> FLEXIBLE MICRO SYSTEM STRUCTURE FOR BEING FORMED BY MATCHING A MULTICHIP/SINGLE CHIP WITH A FLEXIBLE MATERIAL AND A METHOD MANUFACTURING THEREOF

FLEXIBLE MICRO SYSTEM STRUCTURE FOR BEING FORMED BY MATCHING A MULTICHIP/SINGLE CHIP WITH A FLEXIBLE MATERIAL AND A METHOD MANUFACTURING THEREOF

机译:通过用柔性材料匹配多芯片/单芯片而形成的柔性微系统结构及其制造方法

摘要

PURPOSE: A flexible micro system structure and a method manufacturing thereof are provided to be widely applied to a high frequency application field, a biological medicine field, and a flexible display by increasing the flexibility of a process.;CONSTITUTION: A sacrificial layer is formed on a control substrate(10). A flexible substrate(12) is formed on the sacrificial layer. A first conductive structure(13) is formed on the flexible substrate. One or more electronic components(20), in which a second conductive structure corresponding to the first conductive structure is installed, is prepared. The electronic component is fixed to the flexible substrate.;COPYRIGHT KIPO 2012
机译:目的:通过增加工艺的灵活性,提供一种柔性微系统结构及其制造方法,以广泛应用于高频应用领域,生物医学领域和柔性显示器。;构成:形成牺牲层在对照基板(10)上。在牺牲层上形成柔性基板(12)。在柔性基板上形成第一导电结构(13)。准备其中安装了与第一导电结构相对应的第二导电结构的一个或多个电子部件(20)。电子元件固定在柔性基板上。; COPYRIGHT KIPO 2012

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