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Naked microelectronic chip provided with a slot that forms a housing for a filar element constituting a flexible mechanical support, manufacturing process and microstructure

机译:带有槽的裸微电子芯片,该槽形成用于构成柔性机械支撑,制造工艺和微结构的丝状元件的外壳

摘要

Microelectronic chip (1) that includes an electrically conductive filar element (10,11), two main front and rear parallel faces (4, 5), side faces (6, 7) and a recess forming a housing for the electrically filar element conductor (10, 11), the recess being a groove placed on one of the main or side faces, the groove having an axis parallel to the main faces for a fastening fixation of the electrically conductive filar element (10, 11) in said groove , the chip being provided with at least one electrical connection element intended to connect a microelectronic component integrated in the chip with the wire element, the electrical connection element being, in the case of a groove placed on a side face, at least partly constituted by an electrically conductive layer that at least partially covers said groove; chip characterized in that the insertion of the electrically conductive filar element (10, 11) in said slot follows the longitudinal axis of the latter, said electrically conductive filar element (10, 11) constituting a flexible mechanical support for said chip.
机译:微电子芯片(1),其包括导电丝状元件(10,11),两个主要的前后平行主面(4、5),侧面(6、7)和一个用于形成所述导电丝状元件导体的壳体的凹槽(10、11),该凹槽是放置在主表面或侧面之一上的凹槽,该凹槽具有与主表面平行的轴线,用于将导电丝状元件(10、11)紧固固定在所述凹槽中,所述芯片设置有至少一个电连接元件,所述电连接元件用于将集成在所述芯片中的微电子部件与所述导线元件连接,在凹槽被置于侧面的情况下,所述电连接元件至少部分地由电连接元件构成。至少部分覆盖所述凹槽的导电层;芯片,其特征在于,导电丝状元件(10、11)在所述槽中的插入遵循槽的纵轴,所述导电丝状元件(10、11)构成用于所述芯片的柔性机械支撑。

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