ELECTRICAL CONNECTION DEVICE OF A SEMICONDUCTOR DEVICE FOR AN ELECTRICAL FEATURE TEST WHICH ADOPTS A SUITABLE WIRING PATTERN ACCORDING TO AN INSPECTION TARGET OBJECT, AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: An electrical connection device of a semiconductor device for an electrical feature test and a manufacturing method thereof are provided to improve wiring reliability by electrically connecting a substrate and a wiring block through an adhesive sheet in which a wiring pattern is formed.;CONSTITUTION: A predetermined circuit part(101) is included on the upper side of a substrate(100). A plurality of penetration holes(102) is formed on the substrate. A wiring block(200) is inserted into the penetration hole of the substrate. A wiring pattern(201) which electrically interlinks top and bottom sides of the substrate is formed in the wiring block. A conductive cross linkage means(300) electrically interlinks a circuit part of the substrate and an electric wire of the wiring block.;COPYRIGHT KIPO 2012