APPARATUS FOR MOLDING A PACKAGING SEMICONDUCTOR CAPABLE OF ELIMINATING THE INCOMPLETE VOID OF MOLDING AND A MOLDING METHOD THEREOF

摘要

PURPOSE: An apparatus for molding a packaging semiconductor and a molding method thereof are provided to improve the flow of a molding resin on the whole by directly applying pressure to the molding resin at a flow direction of the molding resin.;CONSTITUTION: A molding mold(110) includes an upper mold(120) with a first cavity(121) and a lower mold(130) with a second cavity(131). A plurality of runners for running a liquid type molding resin is prepared in the upper mold. An ram(140) transfers a solid molding resin(A) to the insides of the lower mold and the upper mold. An ultrasonic oscillator(150) includes a ultrasonic generating part(151) generating an ultrasonic wave and an ultrasonic receiver(152) receiving the ultrasonic wave. The ultrasonic generating part and the ultrasonic receiver are pressed in a first groove and a second groove.;COPYRIGHT KIPO 2012