SEMICONDUCTOR LIGHT EMITTING DIODE CHIP CAPABLE OF TRACKING AND MANAGING A HISTORY OF A WAFER BASE PROCESS, A MANUFACTURING METHOD, AND A QUALITY MANAGEMENT METHOD THEREOF

摘要

PURPOSE: A semiconductor light emitting diode chip, a manufacturing method, and a quality management method thereof are provided to diagnose a cause of a problem according to characteristics of a package product within a wafer base process region by recognizing a chip information mark through a vision system or with naked eye after completing a package.;CONSTITUTION: A semiconductor laminated body(12) is arranged on a substrate(11). The semiconductor laminated body comprises a first compound semiconductor layer(12a), a second compound semiconductor layer(12b), and an active layer(12c). A transparent electrode layer(14) is arranged on the upper surface of the second compound semiconductor layer. A first electrode(15) and a second electrode are respectively and electrically connected to the first and second compound semiconductor layers. A chip information mark is formed on the upper surface of the second compound semiconductor layer. The chip information mark displays information related to a wafer base process.;COPYRIGHT KIPO 2012