THROUGH-MOLD-VIA PACKAGE-ON-PACKAGE MANUFACTURING METHOD CAPABLE OF IMPROVING SURFACE-MOUNT-DEVICE YIELD

摘要

PURPOSE: A through-mold-via package-on-package manufacturing method is provided to cover an exposed part of an upper solder ball of a lower semiconductor package with organic soldering preservatives, thereby preventing incomplete fusion problem of a solder joint.;CONSTITUTION: A semiconductor chip(312) is bonded on the upper surface of a lower semiconductor package substrate(311). An upper solder ball(314) is formed on an upper pad(316) of the lower semiconductor package substrate. The semiconductor chip and the upper solder ball are molded with a molding material(313). A lower solder ball(318) is welded on the lower surface of the lower semiconductor package substrate. An organic soldering preservative(319) is coated on an exposed part of the upper solder ball.;COPYRIGHT KIPO 2012