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METHOD OF MANUFACTURING FLEXIBLE ELECTRONIC DEVICE, FLEXIBLE ELECTRONIC DEVICE AND FLEXIBLE SUBSTRATE USING A LASER BEAM
METHOD OF MANUFACTURING FLEXIBLE ELECTRONIC DEVICE, FLEXIBLE ELECTRONIC DEVICE AND FLEXIBLE SUBSTRATE USING A LASER BEAM
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机译:利用激光束制造柔性电子设备,柔性电子设备和柔性基板的方法
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摘要
PURPOSE: A flexible electronic device manufacturing method using laser, a flexible electronic device, and a flexible substrate are provided to arrange an electronic substrate on a separation surface which has a surface roughness approximately equal to the surface roughness of a flexible motherboard, thereby easily solving a surface roughness problem of the flexible substrate. CONSTITUTION: A flexible substrate(200) is formed on a motherboard(100). The flexible substrate is separated from the motherboard. A carrier substrate in which a laser ablation layer is formed is attached to one surface of the flexible substrate. An electronic device is formed on a separation surface of the flexible substrate. The flexible substrate is separated from the carrier substrate.
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