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METHOD OF MANUFACTURING FLEXIBLE ELECTRONIC DEVICE, FLEXIBLE ELECTRONIC DEVICE AND FLEXIBLE SUBSTRATE USING A LASER BEAM

机译:利用激光束制造柔性电子设备,柔性电子设备和柔性基板的方法

摘要

PURPOSE: A flexible electronic device manufacturing method using laser, a flexible electronic device, and a flexible substrate are provided to arrange an electronic substrate on a separation surface which has a surface roughness approximately equal to the surface roughness of a flexible motherboard, thereby easily solving a surface roughness problem of the flexible substrate. CONSTITUTION: A flexible substrate(200) is formed on a motherboard(100). The flexible substrate is separated from the motherboard. A carrier substrate in which a laser ablation layer is formed is attached to one surface of the flexible substrate. An electronic device is formed on a separation surface of the flexible substrate. The flexible substrate is separated from the carrier substrate.
机译:用途:提供一种使用激光的柔性电子设备制造方法,一种柔性电子设备以及一种柔性基板,以将电子基板布置在分离表面上,该分离表面的表面粗糙度近似等于柔性母板的表面粗糙度,从而易于解决柔性基板的表面粗糙度问题。组成:一个柔性基板(200)形成在主板(100)上。柔性基板与主板分离。在其中形成有激光烧蚀层的载体基板被附接到柔性基板的一个表面。在柔性基板的分离面上形成电子设备。柔性基板与载体基板分离。

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