PHOTO-SENSITIVE RESIN COMPOSITION, A DRY FILM SOLDER RESIST, AND A CIRCUIT BOARD CAPABLE OF IMPROVING PHOTO-CURABLE CHARACTERISTIC AND COATING TOLERANCE BY INCLUDING ACID MODIFIED OLIGOMER, PHOTO-POLYMERIZABLE MONOMER, A THERMOSETTING BINDER RESIN, A PHOTO-INITIATOR, AND A THIOXANTHONE COMPOUND

摘要

PURPOSE: A photo-sensitive resin composition, a dry film solder resist, and a circuit board are provided to improve the mechanical characteristic and the heat resistance characteristic of photo-sensitive materials.;CONSTITUTION: A photo-sensitive resin composition includes acid modified oligomer, photo-polymerizable monomer, a thermosetting binder resin, a photo-initiator, and a thioxanthone compound. The thioxanthone compound includes a compound represented by chemical formula 1. In chemical formula 1, R1 to R8 are capable of being identical or different and are respectively C1 to C5 alkyl groups, C1 to C5 alkylene groups, or C1 to C5 alkenyl groups. The acid modified oligomer includes carboxylic group and vinyl group substituted oligomer. The acid value of the acid modified oligomer is between 40 and 120 mgKOH/g. The photo-polymerizable monomer includes a polyfunctional compound with two or more vinyl groups.;COPYRIGHT KIPO 2012