PHOTO-SENSITIVE RESIN COMPOSITION FOR A DRY FILM PHOTORESIST CAPABLE OF IMPROVING PLATING AND ETCHING CHARACTERISTICS BY INCLUDING THE COPOLYMER OF DIENE MONOMER AND ACYLIC ACID

摘要

PURPOSE: A photo-sensitive resin composition for a dry film photoresist is provided to improve the chemical resistance characteristic of cured products.;CONSTITUTION: A photo-sensitive resin composition for a dry film photoresist includes a photopolymerizable multi-functional monomer, a photo-polymerization initiator, and a polymer binder. The photo-sensitive resin composition includes the copolymer of diene monomer and acrylic acid. The copolymer is represented by chemical formula 1. In chemical formula 1, R1 to R3 are respectively hydrogen elements and C1 to C5 alkyl groups; the weight ratio of m:n is 10-90:10-90. The weight average molecular weight of the copolymer is in a range between 10,000 and 150,000.;COPYRIGHT KIPO 2012