POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, A PHOTOSENSITIVE RESIN FILM USING THE COMPOSITION, AND A SEMICONDUCTOR DEVICE INCLUDING THE FILM CAPABLE OF IMPROVING THE SENSITIVITY, THE DEVELOPMENT, THE RESOLUTION, THE RESIDUAL RATE, AND THE SHRINKAGE RATE OF THE COMPOSITION

摘要

PURPOSE: A positive type photosensitive resin composition, a photosensitive resin film using the composition, and a semiconductor device including the film are provided to adjust the dissolution speed of an exposing part and a non-exposing part.;CONSTITUTION: A positive type photosensitive rein composition includes a polybenzoxazole precursor, a novolak resin, a photosensitive diazoquinone compound, a silane compound, and a solvent. The novolak resin includes a compound with a repeating unit represented by chemical formula 6. The polybenzoxazole precursor is selected from a group including a first polybenzoxazole precursor, a second polybenzoxazole precursor, and the combination of the same. The first polybenzoxazole precursor includes a repeating unit represented by chemical formula 1, a repeating unit represented by chemical formula 2, or the combination of the same. A thermal polymerizable functional group is arranged at one end part of the first polybenzoxazole precursor. The second polybenzoxazole precursor includes a repeating unit represented by chemical formula 4, a repeating unit represented by chemical formula 5, or the combination of the same. In chemical formula 6, R7 is identical or different in each repeating unit and is a C1 to C20 aliphatic organic group.;COPYRIGHT KIPO 2012