HEAD BONDING DEVICE FOR A MEMORY SEMICONDUCTOR TESTER WHICH FREELY CONTROLS LOCATION AND ANGLE OF A HEAD

摘要

PURPOSE: A head bonding device for a memory semiconductor tester is provided to rapidly and accurately combining a heat to the memory semiconductor tester.;CONSTITUTION: A back and forth moving part(200) is installed on the top of a moving cart(100). The back and forth moving part is comprised of a first LM(Liner Motion) guide(210) and a first plate(220). The LM guide is installed on the top of the moving cart. The first plate is installed on the first LM guide. A left and right moving part(300) is installed on the top of the back and forth moving part. The left and right moving part is comprised of a second LM guide(310) and a second plate(320). The second LM guide is comprised of a second rail(311) and a second guide block(312). The second rail is installed on the top of the first plate and meets at right angle with the first rail(211). The second guide block moves to left and right sides of the moving cart. A up and down moving part(400) is comprised of a ball screw and a rotary motor.;COPYRIGHT KIPO 2012