POLYAMIDE RESIN COMPOSITION CAPABLE OF OBTAINING EXCELLENT RIGIDITY AND CONDUCTIVITY, LOW MOISTURE ABSORPTION, AND HIGH THERMAL DEFLECTION TEMPERATURE, AND A MOLDED PRODUCT COMPRISING THE SAME

摘要

PURPOSE: A polyamide resin composition is provided to have excellent conductivity, excellent rigidity, high thermal deflection temperature, low moisture absorption, dimensional stability, chemical resistance, and low viscosity.;CONSTITUTION: A polyamide resin composition comprises 100.0 parts by weight of polyamide resin, 30-70 parts by weight of polypropylene, 10-20 parts by weight of maleic anhydride-grafted polypropylene, 20-75 parts by weight of glass fiber, 2-20 parts by weight of multilayer-structure carbon nanotubes. The polyamide resin is selected from nylon 6, nylon 66, and a mixture thereof. The polypropylene is a propylene homopolymer or a propylene ethylene copolymer. Grafting ratio of maleic anhydride in maleic anhydride-grafted polypropylene is 0.5-6 %.;COPYRIGHT KIPO 2012