SEMICONDUCTOR PACKAGE CAPABLE OF PREVENTING A DEFLECTION PHENOMENON DUE TO VOLUME EXPANSION AND CONTRACTION OF A SEMICONDUCTOR CHIP AND A METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a method for manufacturing the same are provided to improve mounting reliability by improving bonding power between a substrate and semiconductor chips.;CONSTITUTION: A substrate(100) comprises a connection terminal(102) having a groove(H) on the surface. Nano-powder(104) is arranged at the bottom of the connection terminal. The nano-powder comprises either copper or silver. A semiconductor chip(110) is flip-chip-bonded on the substrate by the medium of a connection member. The connection member comprises a bonding pad(112) and a bump(114) arranged on the bonding pad. Filler(108) is placed between the substrate and the semiconductor chip. The connection member is inserted in an opening of the filler.;COPYRIGHT KIPO 2012