首页> 外国专利> METHOD FOR INTEGRATING METALS HAVING DIFFERENT WORK FUNCTIONS TO FORM CMOS GATES HAVING A HIGH-K DIELECTRIC AND RELATED STRUCTURE

METHOD FOR INTEGRATING METALS HAVING DIFFERENT WORK FUNCTIONS TO FORM CMOS GATES HAVING A HIGH-K DIELECTRIC AND RELATED STRUCTURE

机译:集成具有不同工作功能的金属以形成具有高K介电及相关结构的CMOS门的方法

摘要

According to one exemplary embodiment, the dual metal gate NMOS 226 and PMOS gate 228 to form the substrate 202, an integrated method for the first metal layer 206 and the second metal layer 208 on the step of depositing a dielectric layer 204 over the NMOS (210) and PMOS region 212 of the substrate (150) a. The method further comprises a step 150 of depositing a first metal layer 206 on the dielectric layer (204). The present method may include a step 150 of depositing a second metal layer 208 on the first metal layer (206) further. The method and converted to the step of injecting nitrogen in the NMOS region 210, 152 and, the metal oxide layer, a first portion of the first metal layer 206, 220 of the substrate 202, a first metal layer (206 a second part further step 154, converting the metal nitride layer 218 a). The method as NMOS gate 226 and PMOS gate (228) forming (156), NMOS gate 226 is a segment (segment) (234) of the metal nitride layer 218 and PMOS gate (228 ) further comprises the step (156) comprising a segment (242) of the metal oxide layer (220).
机译:根据一个示例性实施例,双金属栅极NMOS 226和PMOS栅极228形成衬底202,在NMOS上方沉积介电层204的步骤中,用于第一金属层206和第二金属层208的集成方法( 210)和衬底(150)的PMOS区域212。该方法还包括在介电层(204)上沉积第一金属层206的步骤150。本方法可以包括在第一金属层(206)上进一步沉积第二金属层208的步骤150。该方法并转换为在NMOS区域210、152和金属氧化物层,衬底202的第一金属层206、220的第一部分,第一金属层(206的第二部分)中注入氮的步骤步骤154,转换金属氮化物层218a)。作为NMOS栅极226和PMOS栅极(228)形成(156)的方法,NMOS栅极226是金属氮化物层218的一部分(段)(234),PMOS栅极(228)进一步包括以下步骤(156):金属氧化物层(220)的部分(242)。

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