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AN INTEGRATED CIRCUIT STRUCTURE INCORPORATING AN INDUCTOR, AN ASSOCIATED DESIGN METHOD AND AN ASSOCIATED DESIGN SYSTEM
AN INTEGRATED CIRCUIT STRUCTURE INCORPORATING AN INDUCTOR, AN ASSOCIATED DESIGN METHOD AND AN ASSOCIATED DESIGN SYSTEM
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机译:包含电感器的集成电路结构,相关的设计方法和相关的设计系统
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摘要
Disclosed are embodiments of a circuit (e.g., an electrostatic discharge (ESD) circuit), a design methodology and a design system. In the circuit, an ESD device is wired to a first metal level (e.g., M1). An inductor is formed in a second metal level (e.g., M5) above the first metal level and is aligned over and electrically connected in parallel to the ESD device by a single vertical via stack. The inductor is configured to nullify, for a given application frequency, the capacitance value of the ESD device. The quality factor of the inductor is optimized by providing, on a third metal level (e.g., M3) between the second metal level and the first metal level, a shield to minimize inductive coupling. An opening in the shield allows the via stack to pass through, trading off Q factor reduction for size-scaling and ESD robustness improvements.
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