PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS ON AN ENCAPSULATION SURFACE OF ENCAPSULATION LAYER INCLUDING AN OXIDATION PREVENTION LAYER

摘要

PURPOSE: A package-on-package assembly with wire bonds on an encapsulation surface of encapsulation layer is provided to easily form a monolithic layer on a substrate by depositing a dielectric material on a first substrate and hardening a deposited dielectric material.;CONSTITUTION: A substrate(12) has a first side(14) and a second side(16). The substrate is divided into a first area(18) and a second area(20). A microelectronic element(22) is mounted on a first side of the substrate in the first area. A conductive element(28) includes a contact or a pad(30) exposed to the first side of the substrate. A microelectronic assembly(10) includes a plurality of wire bonds(32) bonded on the pad having the conductive element.;COPYRIGHT KIPO 2012