Polymeric Substrates and Encapsulation for Flexible Electronics: Bonding Structure, Surface Modification and Functional Nanolayer Growth

摘要

In this work, we provide a detailed overview on the incorporation of polymeric substrates, such as Poly(Ethylene Terephthalate)-PET and Poly(Ethylene Naphthalate)-PEN towards the production of future flexible electronics covering all aspects, from surface treatment to the growth mechanisms of transparent functional oxide nanolayers, (e.g. SiO₂) in terms on their bonding structure, surface and interface morphology, stoichiometry, microstructure, optical and mechanical behavior. For this study we have used surface-sensitive, non-destructive characterization techniques, such as in-situ and real-time Spectroscopic Ellipsometry, in an extended spectral region from IR to Vis-farUV, Scanning Probe Microscopies and Nanoindentation in combination to advanced methodologies and modeling procedures.