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Black metal plating method using the same for copper plate with low emissivity and high absorption of solar energy
Black metal plating method using the same for copper plate with low emissivity and high absorption of solar energy
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机译:低辐射率和高太阳能吸收率的铜板用黑金属电镀的方法
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摘要
PURPOSE: A continuous and automatic electrode position method of environment-friendly black potassium chromium sulfate plating having low emissivity and high absorption rate is provided to improve the performance of the endothermic plate through an automatic series coating process. CONSTITUTION: A continuous and automatic electrode position method of environment-friendly black potassium chromium sulfate plating having low emissivity and high absorption rate is as follows. A copper metal plate is washed in 50~60C for 1~3 minutes(10). After a rinse step(20), the copper metal plate is plated in a specific solution for 1~3 minutes using anode Ti basket +S round Ni(Nickel) in 50~55C as an electric current density of 35(30). The solution is manufactured by mixing surfactant of 1~2cc, boric acid of 41g, nickel chloride of 68g, and nickel sulfate of 300g, in water of 1 liter. The copper metal plate is activated in sulfuric acid of 10% in room temperature for 1~3 minutes(50) after a rinse step(40). The copper metal plate is plated in the plating liquid in 20~35C as the current density of 40 at a plating rate of 0.002~0.008mm/min(70) after rinse step(60). The copper metal plate is dried with hot air of 70~80C(90) after a rinse step(80).
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