PROCESS FOR PRODUCING PRINTED WIRING BOARD AND PRINTED WIRING BOARD PRODUCED BY THE PRODUCTION PROCESS

摘要

Can be less expensive and eliminate between the interconnect metal residue with no side etching of the copper layer in a simple process, a fine wire workpieces even to provide a printed wiring board obtained by the manufacturing method and the manufacturing method of a printed wiring board having a sufficient insulation reliability and that for the purpose. ; And directly forming a metal layer not on at least one surface of the insulation film except through the adhesive, and subsequently a method of manufacturing a printed wiring board is for the two-layer flexible printed wiring board a copper film layer is formed on the metal layer, the pattern formed by the etching method not in the etching method, with respect to the two-layer flexible printed wiring board, chlorinated second step of etching treatment by the iron solution or hydrochloric acid, cupric chloride solution containing, continuously by the oxidizing agent of the acid containing a permanganate It characterized in that comprises a step of processing.