A VERTICAL TYPE LED CHIP PACKAGE WITH A GOOD HEAT SINKING PERFORMANCE

摘要

The present invention relates to a heat dissipation of LED chip packages is superior vertical type. Electrical conduction path between the LED chip package of the vertical-type LED chip and the substrate and can improve the heat radiation characteristics by providing an additional heat conduction path separately. Due to the enhanced heat dissipation properties of the LED chip packages it can be obtained an effect such as improving the luminance, life, and reliability improved. ;