SOLDER PASTE HAVING A LOW MELTING POINT AND A MANUFACTURING METHOD THEREOF USING NANO Sn OR Sn-Ag-Cu PARTICLES

摘要

PURPOSE: Solder paste having a low melting point and a manufacturing method thereof using nano Sn or Sn-Ag-Cu particles are provided to reduce energy consumption for processes by using nano-particulate solder paste to lower a melting point.;CONSTITUTION: A method for manufacturing solder paste having a low melting point using nano Sn or Sn-Ag-Cu particles comprises the steps of: making nano Sn or Sn-Ag-Cu particles using DCA(Direct Current Arc), maintaining the nano particles at high concentration through centrifugal separation, and mixing the high-concentration nano particles with flux by ultrasonic waves to obtain paste.;COPYRIGHT KIPO 2012