TEST METHOD FOR YIELDING A KNOWN GOOD DIE

摘要

The semiconductor wafer is cut to the singulated integrated circuit die formed on the wafer. After that, the die pick-machine by placing and orienting the die individualized on the carrier base, signal, power and ground pads formed on the surface of each die has a die pick-machine for the landmarks on the carrier base to optically check be present in the pre-determined location. A die are temporarily held in place on the carrier base state, the die may undergo a series of tests with other processing steps. Signal pads of each die is determined in advance because the location, the die can be accessed by the probe properly aligned to provide the signal to the test equipment access to the pad during the test. After each test, the die pick machine will by replacing any of the die, the test fails to another die, improving the efficiency of the subsequent test and other processing means. ; A semiconductor wafer, integrated circuit die, the carrier base, signal, ground pads, test